CAP 2018-03-08T22:19:25+00:00

CAP: Computer Architecture & Platforms

The Computer Architecture & Platforms Symposium (CAP) aims at bringing together researchers and practitioners that study and build computer systems consisting of disparate components, using different metrics and methods, but providing synergetic effects.  These systems usually act as reusable supporting platforms for a wide range of applications, potentially restricted by specific domains.
CAP is uniquely positioned within COMPSAC to address relevant topics related to the conception, design, deployment and utilization of a variety of architectures and platforms – from mobile to networked data centers. Non-limiting topics include:
  • requirements analysis
  • co-analysis, co-design and co-verification
  • modeling, design, development, testing, measurement, verification and validation for function, performance, safety, security, and dependability constraints of cyber-physical systems and networked systems.
The effective construction of computing systems is not restricted solely to the field of computer science and engineering, but it is truly a multidisciplinary effort. Multidisciplinary work, research and development of software prototypes, industry-university collaborations, all based on emerging and critical concepts and technologies are of particular interest to this symposium.

Paper submission for COMPSAC symposia are now closed.

Deadlines and due dates are available on the Important Dates page.

Paper templates and additional information for authors is available on the Information for Authors page.

CAP Symposium Co-chairs

Cristina Seceleanu, Mälardalen University, Sweden
Keji Kimura, Waseda University, Japan

CAP Program Committee

Mladen Berekovik, TU Braunschweig, Germany
Bernhard Fechner, FU Hagen, Germany
Chun-Hsian Huang, National Taitung University, Taiwan
Ron Kennett, KPA Ltd., University of Torino, Italy
Khalid Latif, Dentsu Aegis Network, Finland
Henry Lönn, AB Volvo, Sweden
Raluca Marinescu, Mälardalen University, Sweden
Hideya Ochiai, The University of Tokyo, Japan
Takatsugu Ono, Kyushu University, Japan
Tiberiu Seceleanu, ABB, Sweden
Mikael Sjödin, Mälardalen University, Sweden
Detlef Streitferdt, University of Ilmenau, Germany
Rajesh Subramanyan, Siemens, USA
Shinya Takamaeda-Yamazaki, Hokkaido University, Japan
Feng-Jian Wang, National Chiao-Tung University, Taiwan
Takashi Yamanoue, Fukuyama University, Japan