IMPORTANT INFORMATION FOR COMPSAC 2022 AUTHORS 

Because of uncertainties related to Covid 19, COMPSAC 2022, currently planned as an in-person event to be held in Turin, Italy, may be conducted in a hybrid format – with some sessions in-person and some over the Internet. If the conference format is hybrid, authors of accepted papers will be able to decide to present their papers either virtually or in-person in Turin. 

However, if the pandemic worsens, the conference will be completely virtual as it was in 2020 and 2021, and all presentations will be done virtually. We will announce in the submission acceptance letters to authors whether the conference will be hybrid or virtual. Registration fees will be adjusted to reflect the format of the conference.

14th IEEE International Workshop on Security Aspects in Processes and Services Engineering (SAPSE 2022) 

Goal of the workshop: 

The workshop aims to foster cooperation among software practitioners and researchers in order to exchange the latest industrial experience and research ideas on services and processes engineering.

Workshop theme: 

The area of processes and services engineering is a very attractive field for innovative research, particularly in the last years, when collaborative and outsourced processing have become an interesting paradigm for developing more complex services available on distributed platforms. Distributed interacting processes have high potential as demonstrated in the case of blockchain technology, allowing a new generation of services and interaction models. These distributed infrastructures often running on remote platforms pose new important challenges particularly when considering security aspects. New techniques and methodologies are needed to be able to build better, more robust and more trusted systems, where security is taken into account and integrated in the whole design process since the very first stages. 

Scope of the workshop: 

Researchers and practitioners all over the world, from both academia and industry, working in the areas of process engineering, distributed services and security, cloud security, blockchain related platforms and applications are invited to discuss state of the art solutions, novel issues, recent developments, applications, methodologies, techniques, experience reports, and tools for the development and use of secure service oriented systems. Topics of interest include, but are not limited to, the following: 

  • Trust, security, and privacy in service-oriented and cloud-based systems 
  • Secure business process composition 
  • Blockchain platforms and blockchain based applications 
  • Security of distributed business processes 
  • Risk management in business processes 
  • Trust and policy management in clouds 
  • Service dependability, survivability, and reliability
  • Design and development of secure service oriented systems
  • Certification of cloud-based and service oriented systems
  • Verification, validation and testing of security properties of service oriented systems

Likely participants: Software engineers and security researchers are called to participate and exchange ideas and techniques.

Please visit Information for Authors for formatting instructions, page limits, and IEEE paper templates.

Important dates for submission and notification are listed here.

Workshop Organizers

Nadia Bennani, Laboratoire d’InfoRmatique en Image et Systèmes d’information (LIRIS) UMR 5205 CNRS INSA-Lyon Bat Blaise Pascal
Email: nadia.bennani@insa-lyon.fr 

Stelvio Cimato, Dipartimento di Informatica, Università degli studi di Milano
Email: stelvio.cimato@unimi.it
Web: http://www.di.unimi.it/cimato/ 

Program Committee

(to be confirmed)

Carlo Blundo, University of Salerno, Italy

Chiara Braghin, Università degli Studi di Milano, Italy

Ernesto Damiani, Università degli Studi di Milano, Italy

Chun-I Fan, National Sun Yat-sen University, Taiwan

Omar Hasan, University of Lyon, France

Fuyuki Ishikawa, National Institute of Informatics, Japan

Dimitris Karagiannis, University of Vienna, Austria

Silvia Mella, STMicroelectronics, Italy

Hung-Min Sun, National Tsing Hua University, Taiwan

James C.N. Yang, National Dong Hwa University, Taiwan

Chan Yeob Yeun, KUSTAR, UAE