IMPORTANT INFORMATION FOR COMPSAC 2022 AUTHORS 

COMPSAC 2022 will be completely virtual as it was in 2020 and 2021, and all presentations will be done virtually. We will announce this update also in the submission acceptance letters to authors. Authors of accepted papers will be required to provide a video of their presentation together with the submission of the final version of their papers. COMPSAC will provide detailed guidance regarding preparation and submission of these videos.

MOWU: Mobile, Wearable & Ubiquitous Computing

Call for Papers

The symposium on Mobile, Wearable, and Ubiquitous Computing (MOWU) is an integral part of the IEEE COMPSAC main conference. Following the theme of the COMPSAC main conference, the MOWU Symposium’s scope covers recent advances in wireless communications and the proliferation of powerful mobile devices that have enabled a wide range of mobile services, everywhere and anytime, supporting the sustainable development of ubiquitous software and infrastructure to transform the digital world intelligently.

MOWU invites both researchers and practitioners to present their recent results, findings, and achievements in all components of the pervasive ubiquitous environments, including the advancement of software and middleware technologies in various mobile-related sectors, ranging from effective synergic management of wireless communications to adaptivity of system software and its development, from the support to crowdsourcing and collaborative filtering to exhibit collective intelligence, to the frontend in collecting big data for machine learning and dynamic offloading to cloud resources for intelligent decision and machine learning support, and even augmented reality applications on mobile devices, just to mention a few. The main goal of MOWU is to deepen the understanding of, fostering innovation in, defining and addressing the challenges in mobile communication regarding current and future mobile services, applications and devices for wearable and ubiquitous computing, and in this year, in the context of intelligent applications.

Please visit Information for Authors for formatting instructions, page limits, and IEEE paper templates.

Important dates for submission and notification are listed here.

Symposium Chairs

AKM Jahangir Alam Majumder, University of South Carolina Upstate, USA
Email: majumder@uscupstate.edu

Ying Cai, Iowa State University, USA
Email: yingcai@iastate.edu