IMPORTANT INFORMATION FOR COMPSAC 2022 AUTHORS
COMPSAC 2022 will be completely virtual as it was in 2020 and 2021, and all presentations will be done virtually. We will announce this update also in the submission acceptance letters to authors. Authors of accepted papers will be required to provide a video of their presentation together with the submission of the final version of their papers. COMPSAC will provide detailed guidance regarding preparation and submission of these videos.
The Fast Abstract symposium seeks to bring together students, faculty, and researchers working in computer software, applications and related fields. The submitted FA article will be reviewed as a Fast Abstract, and should be a two-page article presenting, for example, new ideas, work in progress, or opinions that address issues relevant to computer software, applications and related fields.
We also welcome contributions that may have thought-provoking ideas based on theory, application or development experience, and may have initial or proof of concept results. The presenter will have the opportunity to discuss their research, methodology, and results with other researchers and receive useful guidance and feedback from the community.
Authors are encouraged to submit summaries of their original work (not published or submitted elsewhere). All submissions must be written in English, and be a maximum of two pages in length, in 10-point font using the IEEE conference proceedings format. Each submission should include the title of the paper, a 150-word abstract, and up to 6 keywords. Evaluation of submissions will be based on their originality, significance of the contribution to the field, technical merit, presentation quality, and adherence to abstract submission guidelines. All accepted Fast Abstracts will be published in the electronic COMPSAC 2022 proceedings.
Please visit Information for Authors for formatting instructions, page limits, and IEEE paper templates.
Important dates for submission and notification are listed here.
Fast Abstract Organizers
Michiharu Takemoto, International University of Technology in Tokyo (IPUT), Japan
Nazmus Sakib, SUNY, Buffalo