IMPORTANT INFORMATION FOR COMPSAC 2022 AUTHORS 

COMPSAC 2022 will be completely virtual as it was in 2020 and 2021, and all presentations will be done virtually. We will announce this update also in the submission acceptance letters to authors. Authors of accepted papers will be required to provide a video of their presentation together with the submission of the final version of their papers. COMPSAC will provide detailed guidance regarding preparation and submission of these videos.

EATA: Emerging Advances in Technology & Applications

Call for Papers

EATA uniquely positions itself to be a forum for researchers, practitioners, and educators to present recent findings, innovations, theories, methodologies, and practical experiences to emerging advances in technologies and applications. These advances leverage today’s convergence of massive information sources, powerful analysis techniques, and nearly instant access from any point on the globe. In this symposium, discussions of emerging technologies from the point of view of service and application architecture, as well as service innovations and their deployment in communities by leveraging the cutting-edge technologies are highly appreciated. Conceptual discussions are also welcome. The submitted papers will be evaluated based on their innovation, advancement of technologies, and level of research achievement. Topics solicited include but are not limited to:

  • social network and crowd sourcing
  • e-health and Web well-being
  • smart cities and public spaces
  • sustainable computing
  • cloud, fog and edge computing
  • green computing
  • IoT
  • pervasive computing
  • service federations
  • life log
  • sensor network applications and services
  • morphic computer design
  • blockchain technologies
  • evolutionary computing
  • security

Please visit Information for Authors for formatting instructions, page limits, and IEEE paper templates.

Important dates for submission and notification are listed here.

Symposium Chairs

Ali Hurson, Missouri University of Science & Techology, USA
Email: hurson@mst.edu

Dan Lin, University of Missouri, USA
Email: lindan@missouri.edu