The Software Engineering Technology and Applications (SETA) symposium is the flagship IEEE symposium on software engineering technologies, and an integral part of the IEEE COMPSAC conference. We encourage submissions on the use of data driven intelligence technologies to support software engineering activities, techniques and tools to cope with technical challenges of intelligent world development and pervasive computing in general. The submissions are expected to be high quality research papers that describe original, unpublished work on any topic related to software engineering technology including but not limited to empirical and theoretical work on intelligent software engineering, conventional software engineering and also work on emerging topics.
Authors are invited to submit original, unpublished work presenting research and novel computer applications in full-paper format (10 pages, inclusive of figures, tables, appendices, etc). The review and selection process for submissions is designed to identify submissions that break new ground and provide substantial support for their results and conclusions as significant contributions to the field. Submissions will be selected that represent a major advancement in the subject of the symposia. At least one author of each accepted paper is required to register to the conference and to present the paper in person at the conference.
Please note that SETA submissions should also follow policies from the COMPSAC conference (e.g., plagiarism). Simultaneous submission to other publication venues is not permitted except as highlighted at COMPSAC JC/CJ page. Accepted papers may be invited to prestigious journal(s) for extension after consideration from the COMPSAC conference.
Symposium Chairs
Song Wang
York University
Jacky Keung
City University of Hong Kong
Yuan Tian
Queen’s University, Canada
Program Committee
Everton Alves
Federal University of Campina Grande
Domenico Amalfitano
University of Naples Federico II
Hirohisa Aman
Ehime University
Wilkerson L. Andrade
Federal University of Campina Grande
Kyungmin Bae
Pohang University of Science and Technology
Lingfeng Bao
Zhejiang University
Fevzi Belli
University of Paderborn
Rafael Capilla
Universidad Rey Juan Carlos
Haihua Chen
University of North Texas
Songqiang Chen
The Hong Kong University of Science and Technology
Yunja Choi
Kyungpook National University
Yunhe Feng
University of North Texas
Radu Gaceanu
Babes‑Bolyai University
Ian Gorton
Northeastern University
Huizi Hao
Queens University
Kazi Amit Hasan
Queen’s University
Xiao He
University of Science and Technology Beijing
Shin Hong
Chungbuk National University
Wenhua Hu
Wuhan University of Technology
Liguo Huang
Southern Methodist University
Akinori Ihara
Wakayama University
Bo Jiang
Beihang University
Dongming Jin
Peking University
Mohamad Kassab
Boston University
Dj Kim
DePaul University
In‑Young Ko
Korea Advanced Institute of Science and Technology
Yulia Kumar
Kean University
Hiroaki Kuwabara
Nanzan University
Chung Lawrence
University of Texas at Dallas
Jihyun Lee
Jeonbuk National University
Seonah Lee
Gyeongsang National University
Yan Lei
Chongqing University
Dongcheng Li
California State Polytechnic University – Humboldt
Hao Li
Queen’s University
Jia Li
Peking University
Jialong Li
Waseda University
Yishu Li
City University of Hong Kong
Zhenhao Li
York University
Peng Liang
Wuhan University
Chun‑Feng Liao
National Chengchi University
Lizhi Liao
Memorial University of Newfoundland
Yihan Liao
City University of Hong Kong
Chao Liu
Chongqing University
Chien‑Hung Liu
National Taipei University of Technology
Huai Liu
Swinburne University of Technology
Shuo Liu
City University of Hong Kong
Zhongxin Liu
Zhejiang University
Xiapu Luo
The Hong Kong Polytechnic University
Thibaud Lutellier
University of Alberta
Xiaoxue Ma
Hong Kong Metropolitan University
Zhenyu Mao
City University of Hong Kong
Katsuhisa Maruyama
Ritsumeikan University
Qing Mi
Beijing University of Technology
Manishankar Mondal
University of Saskatchewan
Akito Monden
Okayama University
Chao Ni
Zhejiang University
Changhai Nie
Nanjing University
Masao Ohira
Wakayama University
Miguel Ángel Olivero González
University of Seville
Moses Openja
Mbarara University of Science and Technology
Yu Pei
The Hong Kong Polytechnic University
Hung Viet Pham
York University
Triet Pham
Concordia University
Kun Qiu
Hefei University of Technology
Chaiyong Ragkhitwetsagul
Mahidol University
Xiaoxue Ren
Zhejiang University
Daniel Rodriguez
The University of Alcalá
Sharad Sharma
University of North Texas
Kazumasa Shimari
Nara Institute of Science and Technology
Jiho Shin
Queen’s University
Zackary P. T. Sin
Hong Kong Polytechnic University
Jiayang Song
Macau University of Science and Technology
Yicheng Sun
City University of Hong Kong
Shingo Takada
Keio University
Yutian Tang
University of Glasgow
Yuan Tian
Queen’s University
Christoph Treude
Singapore Management University
Tatsuhiro Tsuchiya
Osaka University
Masateru Tsunoda
Kindai University
Eray Tüzün
Bilkent University
Naoyasu Ubayashi
Waseda University
Yao Wan
Huazhong University of Science and Technology
Wei‑Jen Wang
National Central University
Jun Wei
Chinese Academy of Sciences
Zhengyuan Wei
The Education University of Hong Kong
Bo Yang
Concordia University
Zhen Yang
Shandong University
Kundi Yao
Ontario Tech University
Guangba Yu
Sun Yat‑Sen University
Xiao Yu
Zhejiang University
Cao Yuchen
City University of Hong Kong
Fengji Zhang
City University of Hong Kong
He Zhang
Nanjing University
Hongyu Zhang
The University of Newcastle
Jingyu Zhang
City University of Hong Kong
Mingyue Zhang
Southwest University
Tao Zhang
Macau University of Science and Technology
Kunsong Zhao
The Hong Kong Polytechnic University
Yanjie Zhao
Huazhong University of Science and Technology
Hao Zhong
Shanghai Jiao Tong University
Shaomin Zhu
Tongji University
Key Symposium Dates
Symposium Paper submission:
Extended to 20 February 2026 31 January 2026
Symposium Paper Acceptance Notification:
12 April 2026
Camera Ready Paper submission:
21 May 2026
Paper Templates
IEEE Paper templates are available in MS Word, LaTex, and Overleaf. All submissions must use US 8.5×11 letter page format.
IEEE Conference Publishing Policies
All submissions must adhere to IEEE Conference Publishing Policies.
Open Access Option
Authors may choose to publish their accepted papers as open access. For details, please refer to the Author Information page.
IEEE Cross Check
All submission will be screened for plagiarized material through the IEEE Cross Check portal.