COMPSAC 2026 Symposium on Computer Architecture & Platforms (CAP)

The Computer Architecture & Platforms Symposium (CAP) aims at bringing together researchers and practitioners that study and build computer systems consisting of disparate components, using different metrics and methods, but providing synergetic effects.  These systems usually act as reusable supporting platforms for a wide range of applications, potentially restricted by specific domains.

 
CAP is uniquely positioned within COMPSAC to address relevant topics related to the conception, design, deployment and utilization of a variety of architectures and platforms – from mobile to networked data centers. Non-limiting topics include:
  • requirements analysis
  • co-analysis, co-design and co-verification
  • modeling, design, development, testing, measurement, verification and validation for function, performance, safety, security, and dependability constraints of cyber-physical systems and networked systems.
The effective construction of computing systems is not restricted solely to the field of computer science and engineering, but it is truly a multidisciplinary effort. Multidisciplinary work, research and development of software prototypes, industry-university collaborations, all based on emerging and critical concepts and technologies are of particular interest to this symposium
Submission Link

Symposium Chairs

Yasutaka Wada
Meiji Gakuin University, Japan

Cristina Seceleanu
Mälardalen University

Program Committee

Mladen Berekovic
University of Lübeck
Mikael Ekström
Mälardalen University
Ron Kenett
KPA Group
Khalid Latif
Nokia
Muhammad Naeem
Mälardalens University
Tiberiu Seceleanu
Mälardalen University
Mikael Sjödin
Mälardalen University
Detlef Streitferdt
Ilmenau University of Technology
Shinya Takamaeda‑Yamazaki
The University of Tokyo
Dan Umeda
TIER IV, Inc.
Takashi Yamanoue
Fukuyama University

Key Symposium Dates

Symposium Paper submission:
Extended to 20 February 2026   31 January 2026
Symposium Paper Acceptance Notification:
12 April 2026
Camera Ready Paper submission:
21 May 2026

Paper Templates

IEEE Paper templates are available in MS Word, LaTex, and Overleaf. All submissions must use US 8.5×11 letter page format.

IEEE Conference Publishing Policies

All submissions must adhere to IEEE Conference Publishing Policies.

Open Access Option

Authors may choose to publish their accepted papers as open access. For details, please refer to the Author Information page.

IEEE Cross Check

All submission will be screened for plagiarized material through the IEEE Cross Check portal.