SAPSE 2023: The 15th IEEE International Workshop on Security Aspects in Processes and Services Engineering
Technical Program
*= in-person presentation in Torino
Transparency-based reconnaissance for APT attacks*
Alessio Rugo and Claudio Ardagna
API-based features representation fusion for malware classification*
Yassine Belkhouche
Goal of the workshop:
The workshop aims to foster cooperation among software practitioners and researchers in order to exchange the latest industrial experience and research ideas on services and processes engineering.
Workshop theme:
The area of processes and services engineering is a very attractive field for innovative research, particularly in the last years, when collaborative and outsourced processing have become an interesting paradigm for developing more complex services available on distributed platforms. Distributed interacting processes have high potential as demonstrated in the case of blockchain technology, allowing a new generation of services and interaction models. These distributed infrastructures often running on remote platforms pose new important challenges particularly when considering security aspects. New techniques and methodologies are needed to be able to build better, more robust and more trusted systems, where security is taken into account and integrated in the whole design process since the very first stages.
Scope of the workshop:
Researchers and practitioners all over the world, from both academia and industry, working in the areas of process engineering, distributed services and security, cloud security, blockchain related platforms and applications are invited to discuss state of the art solutions, novel issues, recent developments, applications, methodologies, techniques, experience reports, and tools for the development and use of secure service oriented systems. Topics of interest include, but are not limited to, the following:
- Trust, security, and privacy in service-oriented and cloud-based systems
- Secure business process composition
- Blockchain platforms and blockchain based applications
- Security of distributed business processes
- Risk management in business processes
- Trust and policy management in clouds
- Service dependability, survivability, and reliability
- Design and development of secure service oriented systems
- Certification of cloud-based and service oriented systems
- Verification, validation and testing of security properties of service oriented systems
Paper Templates
IEEE Paper templates are available in MS Word 2003 and LaTex. All submissions must use US 8.5×11 letter page format.
Important Dates
Main Conference/Symposium
Main conference/symposium papers due: 15 January 2023Extended to 15 February 2023
Notification: 7 April 2023
Camera-ready and registration due: 7 May 2023 Updated: 18 May 2023
Journal then Conference Submissions
Due date: April 7, 2023
Notifications: April 30, 2023
Workshops, Fast Abstract, SRS Programs
EXTENDED: Workshop papers due: 21 April 2023
UPDATED: Notifications: 7 May 2023
UPDATED: Camera-ready and registration due: Updated: 18 May 2023
Submission Link
Please submit your paper on EasyChair
IEEE Conference Publishing Policies
All submissions must adhere to IEEE Conference Publishing Policies.
IEEE Cross Check
All submission will be screened for plagiarized material through the IEEE Cross Check portal.
Workshop Organizers
Workshop Co-Chairs
Nadia Bennani, Laboratoire d’InfoRmatique en Image et Systèmes d’information (LIRIS) UMR 5205 CNRS INSA-Lyon Bat Blaise Pascal
Email: nadia.bennani@insa-lyon.fr
Stelvio Cimato, Dipartimento di Informatica, Università degli studi di Milano
Email: stelvio.cimato@unimi.it
Web: http://www.di.unimi.it/cimato/
Program Committee
Carlo Blundo, University of Salerno, Italy
Chiara Braghin, Università degli Studi di Milano, Italy
Ernesto Damiani, Università degli Studi di Milano, Italy
Chun-I Fan, National Sun Yat-sen University, Taiwan
Omar Hasan, University of Lyon, France
Fuyuki Ishikawa, National Institute of Informatics, Japan
Dimitris Karagiannis, University of Vienna, Austria
Silvia Mella, STMicroelectronics, Italy
Hung-Min Sun, National Tsing Hua University, Taiwan
James C.N. Yang, National Dong Hwa University, Taiwan
Chan Yeob Yeun, KUSTAR, UAE