COMPSAC 2023 Symposium on Computer Architecture & Platforms (CAP)
Technical Program
*= in-person presentation in Torino
Program Balancing in Compilation for Buffered Hybrid Dataflow Processors
Anoop Bhagyanath and Klaus Schneider
FACEE: Framework for Automating CNN Explainability Evaluation*
Ahmad Rezaei, Johannes Nau, Johannes Richter, Detlef Streitferdt and Jörg Schambach
Efficient hard real-time implementation of CNNs on multi-core architectures*
Jonas Peeck, Robin Hapka and Rolf Ernst
Memory-virtualizing and -devirtualizing VM migration with Private Virtual Memory*
Yuji Muraoka and Kenichi Kourai
L2 cache access pattern analysis using static profiling of an application*
Theodora Adufu and Yoonhee Kim
- requirements analysis
- co-analysis, co-design and co-verification
- modeling, design, development, testing, measurement, verification and validation for function, performance, safety, security, and dependability constraints of cyber-physical systems and networked systems.
Paper Templates
IEEE Paper templates are available in MS Word 2003 and LaTex. All submissions must use US 8.5×11 letter page format.
Important Dates
Main Conference/Symposium
Main conference/symposium papers due: 15 January 2023Extended to 15 February 2023
Notification: 7 April 2023
Camera-ready and registration due: 7 May 2023 Updated: 18 May 2023
Journal then Conference Submissions
Due date: April 7, 2023
Notifications: April 30, 2023
Workshops, Fast Abstract, SRS Programs
EXTENDED: Workshop papers due: 21 April 2023
UPDATED: Notifications: 7 May 2023
UPDATED: Camera-ready and registration due: Updated: 18 May 2023
Submission Link
Please submit your paper on EasyChair
IEEE Conference Publishing Policies
All submissions must adhere to IEEE Conference Publishing Policies.
IEEE Cross Check
All submission will be screened for plagiarized material through the IEEE Cross Check portal.
CAP Symposium Chairs
Yasutaka Wada, Meisei University
Email: yasutaka.wada@meisei-u.ac.jp
Cristina Seceleanu, Mälardalen University
cristina.seceleanu@mdu.se
Program Committee
Saad Mubeen, Mälardalen University
Henrik Lonn, Volvo Group
Takashi Yamanoue, Fukuyama University
Chun-Hsian Huang, National Taitung University
Shinya Takamaeda-Yamazaki, The University of Tokyo
Khalid Latif, Nokia
Tiberiu Seceleanu, Mälardalen University
Bernhard Fechner, Universität Hagen
Detlef Steitferdt, Ilmenau University of Technology
Feng-Jian Wang
Ron Kenett, KPA Ltd. and Samuel Neaman Institute, Technion, Israel
Mladen Berekovic, ITI, Uni Luebec