Resilient Computing and Computing for Resilience in a Sustainable Cyber-Physical World
Authors are invited to submit original, unpublished research work and industrial practice reports. Simultaneous submission to other publication venues is not permitted except as highlighted in the COMPSAC 2023 JC & CJ program. All submissions must adhere to IEEE Conference Publishing Policies and will be vetted through the IEEE CrossCheck portal.
COMPSAC 2023 is organized by a main conference symposia program, a workshops program for work not ready for main conference publication, and a number of special sessions such as Fast Abstract and Doctoral Symposium.
COMPSAC 2023 will be offered as a hybrid conference. In-person attendance is recommended, but virtual presentation formats will be available for those unable to attend in Torino.
The JC (Journal/Conference) Program
Authors of papers published in a peer-reviewed journal (or accepted for publication) can present their plans for ongoing research based on the work described in that paper at this year’s COMPSAC. Authors must submit their published article (or its DOI) and a two-page description of their planned extension to the content of that paper. Use the JC process if you are a previous author and wish to seek comments and suggestions from conference attendees regarding your planned research extensions.
IEEE Paper templates are available in MS Word 2003 and LaTex. All submissions must use US 8.5×11 letter page format.
Main conference/symposium papers due:
15 January 2023Extended to 15 February 2023
Notification: 1 April 2023
Camera-ready and registration due: 1 May 2023
Journal then Conference Submissions
Due date: April 7, 2023
Notifications: April 30, 2023
Workshop papers due: 7 April 2023
Notifications: 1 May 2023
Camera-ready and registration due: 7 May 2023
Please submit your paper on EasyChair
IEEE Conference Publishing Policies
All submissions must adhere to IEEE Conference Publishing Policies.
IEEE Cross Check
All submission will be screened for plagiarized material through the IEEE Cross Check portal.