The 3rd IEEE International Workshop on Smart & Sustainable Mobility & Logistics in Smart Cities (SSMLS 2021)
Call for Papers
SSMLS 2021 aims to foster cooperation among practitioners and researchers in order to exchange the latest industrial experience and research ideas on the development of products and services for smart and sustainable mobility and logistics in Smart Cities.
Urban mobility is one of the toughest challenges we all face today, as existing mobility systems are not smart and sustainable enough to cope with the increasing demand. These issues are true for both passenger and freight mobility. In addition, mobility needs are evolving. Changing travel habits, demand for services to increase convenience, speed and predictability, mobility-as-a-service and e-freight are emerging as new mobility paradigms. Planning and decision-making is evolving toward a more evidence-based approach, as well as evolving customer expectations toward individualization and sustainability will require mobility service innovation as well as business model transformation.
Researchers and practitioners all over the world, from both academia and industry, working in the areas of Smart Cities, City Logistics, Sustainable Transportation and Sharing Mobility are invited to discuss state of the art solutions, novel issues, recent developments, applications, methodologies and techniques. Topics of interest include, but are not limited to:
- Cooperative intelligent transportation systems
- Road transport automation
- Electric mobility
- Maps and travel planning
- Mobility modelling
- Behaviour change approaches
- Travel demand estimation and modelling
- Evidence-based planning and decision-making
- Big Data and analytics in transport
- New Business models in mobility and logistics
- Blockchain and trusted network for mobility and logistics
Workshop papers due:
21 April 1 May 2021 (UPDATED)
Workshop paper notifications: 15 May 2021
Camera-ready and registration due: 31 May 2021
Authors are invited to submit original, unpublished research work, as well as industrial practice reports. Simultaneous submission to other publication venues is not permitted. In accordance with IEEE policy, submitted manuscripts will be checked for plagiarism. Instances of alleged misconduct will be handled according to the IEEE Publication Services and Product Board Operations Manual.
Please note that in order to ensure the fairness of the review process, COMPSAC follows the double-blind review procedure. Therefore we kindly ask authors to remove their names, affiliations and contacts from the header of their papers in the review version. Please also redact all references to authors’ names, affiliations or prior works from the paper when submitting papers for review. Once accepted, authors can then include their names, affiliations and contacts in the camera-ready revision of the paper, and put the references to their prior works back.
Workshop papers are limited to 6 pages. Page limits are inclusive of tables, figures, appendices, and references. Workshop papers can add an additional 2 pages with additional page charges ($250USD/page).
IEEE Paper templates are available in MS Word 2003 and LaTex. All submissions must use US 8.5×11 letter page format.