SETA: Software Engineering Technologies & Applications
Call for Papers
The Software Engineering Technology and Applications (SETA) symposium is the flagship IEEE symposium on software engineering technologies, and an integral part of the IEEE COMPSAC conference. Following the “Intelligent and Resilient Computing for a Collaborative World” theme of COMPSAC 2021, we encourage submissions on the use of data driven intelligence technologies to support software engineering activities, techniques and tools to cope with technical challenges of intelligent world development and pervasive computing in general. The submissions are expected to be high quality research papers that describe original, unpublished work on any topic related to software engineering technology including but not limited to empirical and theoretical work on intelligent software engineering, conventional software engineering and also work on emerging topics.
Authors are invited to submit original, unpublished work presenting research and novel computer applications in full-paper format (10 pages, inclusive of figures, tables, appendices, etc). The review and selection process for submissions is designed to identify submissions that break new ground and provide substantial support for their results and conclusions as significant contributions to the field. Submissions will be selected that represent a major advancement in the subject of the symposia. At least one author of each accepted paper is required to register to the conference and to present the paper in person at the conference.
Please note that SETA submissions should also follow policies from the COMPSAC conference (e.g., plagiarism). Simultaneous submission to other publication venues is not permitted except as highlighted at COMPSAC C1J2 & J1C2 Schemes page. Accepted papers may be invited to prestigious journal(s) for extension after consideration from the COMPSAC conference.
UPDATED: Main conference papers due: 18 Feb 2021
Paper notification: 15 April 2021
Camera-ready and registration due: 31 May 2021
Authors are invited to submit original, unpublished research work, as well as industrial practice reports. Simultaneous submission to other publication venues is not permitted. In accordance with IEEE policy, submitted manuscripts will be checked for plagiarism. Instances of alleged misconduct will be handled according to the IEEE Publication Services and Product Board Operations Manual.
Please note that in order to ensure the fairness of the review process, COMPSAC follows the double-blind review procedure. Therefore we kindly ask authors to remove their names, affiliations and contacts from the header of their papers in the review version. Please also redact all references to authors’ names, affiliations or prior works from the paper when submitting papers for review. Once accepted, authors can then include their names, affiliations and contacts in the camera-ready revision of the paper, and put the references to their prior works back.
Page limits are inclusive of tables, figures, appendices, and references. Full conference papers and workshop papers can add an additional 2 pages with additional page charges ($250USD/page).
Full conference papers: 10 pages
Journal then Conference (JC) papers: 2 pages
Industrial Practice Reports: 10 pages
Short Papers: 6 pages
Fast Abstracts: 2 pages
Student Research Symposium papers: 4 pages
Posters: 1 page
IEEE Paper templates are available in MS Word 2003 and LaTex. All submissions must use US 8.5×11 letter page format.
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Hong Zhu, Oxford Brookes University, UK
Junhua Ding, University of North Texas, USA
Rui Abreu, INESC-ID and University of Porto, Portugal