MOWU: Mobile, Wearable & Ubiquitous Computing
Call for Papers
The symposium on Mobile, Wearable, and Ubiquitous Computing (MOWU) is an integral part of the IEEE COMPSAC main conference. Following the theme of the COMPSAC main conference, the MOWU Symposium’s scope covers recent advances in wireless communications and the proliferation of powerful mobile devices that have enabled a wide range of mobile services, everywhere and anytime, supporting the sustainable development of ubiquitous software and infrastructure to transform the digital world intelligently.
MOWU invites both researchers and practitioners to present their recent results, findings, and achievements in all components of the pervasive ubiquitous environments, including the advancement of software and middleware technologies in various mobile-related sectors, ranging from effective synergic management of wireless communications to adaptivity of system software and its development, from the support to crowdsourcing and collaborative filtering to exhibit collective intelligence, to the frontend in collecting big data for machine learning and dynamic offloading to cloud resources for intelligent decision and machine learning support, and even augmented reality applications on mobile devices, just to mention a few. The main goal of MOWU is to deepen the understanding of, fostering innovation in, defining and addressing the challenges in mobile communication regarding current and future mobile services, applications and devices for wearable and ubiquitous computing, and in this year, in the context of intelligent applications.
UPDATED: Main conference papers due: 18 Feb 2021
Paper notification: 15 April 2021
Camera-ready and registration due: 31 May 2021
Authors are invited to submit original, unpublished research work, as well as industrial practice reports. Simultaneous submission to other publication venues is not permitted. In accordance with IEEE policy, submitted manuscripts will be checked for plagiarism. Instances of alleged misconduct will be handled according to the IEEE Publication Services and Product Board Operations Manual.
Please note that in order to ensure the fairness of the review process, COMPSAC follows the double-blind review procedure. Therefore we kindly ask authors to remove their names, affiliations and contacts from the header of their papers in the review version. Please also redact all references to authors’ names, affiliations or prior works from the paper when submitting papers for review. Once accepted, authors can then include their names, affiliations and contacts in the camera-ready revision of the paper, and put the references to their prior works back.
Page limits are inclusive of tables, figures, appendices, and references. Full conference papers and workshop papers can add an additional 2 pages with additional page charges ($250USD/page).
Full conference papers: 10 pages
Journal then Conference (JC) papers: 2 pages
Industrial Practice Reports: 10 pages
Short Papers: 6 pages
Fast Abstracts: 2 pages
Student Research Symposium papers: 4 pages
Posters: 1 page
IEEE Paper templates are available in MS Word 2003 and LaTex. All submissions must use US 8.5×11 letter page format.
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Hong Va Leong, Hong Kong Polytechnic University, Hong Kong
Program Committee Chairs
Sencun Zhu, Pennsylvania State University
Ying Cai, Iowa State University