The 3rd IEEE International Workshop on Big Data Computation, Analysis & Applications (BDCAA 2021)

Call for Papers


The workshop aims to solicit cooperation and discussions among researchers specializing in interdisciplinary and complimentary domains that leverage applications that generate and analyze big data on High Performance Computing (HPC) resources.

Technological, medical, scientific, and societal advancements are more and more realized via applications that are driven by the expertise of researcher at the intersection of multiple domains. Disciplines that in the past did not collaborate extensively are more and more working on joint projects that require the smart synthesis of ideas and domain-specific skills. Many facets of interdisciplinary projects that aim to deliver smart solutions to address critical problems bring about challenges and opportunities. This workshop will solicit manuscripts for presentation and discussion of the computation and analysis challenges of interdisciplinary projects drawing from the expertise of a variety of disciplines.

This workshop welcomes any research addressing the big question of “How do applications in various domains leverage HPC to generate and analyze big data for solving societal problems?” Researchers are invited to submit and ultimately present state of the art solutions requiring the analysis or generation of big data using HPC resources, for decision making. Topics of interest include, but are not limited to, the following:

  • Big data, data-driven medical diagnosis and analysis
  • Real-time decision making for compute in the edge
  • Use of large-scale distributed system such as supercomputers, grids, or clouds
  • Theoretical Considerations and Analysis of Big Data Applications in the cloud
  • Data dimensionality reduction techniques for large scale analysis of biological data
  • Visual data analytics for large-scale and/or high-dimensional data
  • Big data, smart sampling and analysis techniques for medical decision making
  • Large-scale mobile sensor data for just-in-time health care intervention

Important Dates


Workshop papers due: 21 April 2021

Workshop paper notifications: 15 May 2021

Camera-ready and registration due: 31 May 2021


Authors are invited to submit original, unpublished research work, as well as industrial practice reports. Simultaneous submission to other publication venues is not permitted.  In accordance with IEEE policy, submitted manuscripts will be checked for plagiarism. Instances of alleged misconduct will be handled according to the IEEE Publication Services and Product Board Operations Manual.

Please note that in order to ensure the fairness of the review process, COMPSAC follows the double-blind review procedure. Therefore we kindly ask authors to remove their names, affiliations and contacts from the header of their papers in the review version. Please also redact all references to authors’ names, affiliations or prior works from the paper when submitting papers for review. Once accepted, authors can then include their names, affiliations and contacts in the camera-ready revision of the paper, and put the references to their prior works back.

Formatting


Workshop papers are limited to 6 pages. Page limits are inclusive of tables, figures, appendices, and references. Workshop papers can add an additional 2 pages with additional page charges ($250USD/page).

Paper Templates


IEEE Paper templates are available in MS Word 2003 and LaTex. All submissions must use US 8.5×11 letter page format.



Workshop Organizers


Shameem Ahmed, Western Washington University, USA
Email: ahmeds@wwu.edu,

Filip Jagodzinski, Western Washington University, USA
Email: filip.jagodzinski@wwu.edu

Tanzima Islam, Texas State University, USA
Email: tanzima@txstate.edu

Program Committee


Moushumi Sharmin, Western Washington University

Tanzima Islam, Texas State University

Filip Jagodzinski, Western Washington University

Shameem Ahmed, Western Washington University

Hillol Sarker, IBM Cambridge Research Center, Cambridge, MA USA

Mahbubur Rahman, Samsung Research America, CA, USA

Muntasir Raihan Rahman, Microsoft, WA, USA